I. Equipment Design and Operation Control
The multi-wire cutting machine is specifically designed for cutting large-sized, heavy stone blocks. The core of the equipment consists of a frame and multiple sets of parallel diamond wire meshes, enabling simultaneous slicing of a single block, significantly improving output efficiency. The diamond wires are driven by guide wheels and subjected to constant tension, ensuring a stable and continuous cutting process and achieving efficient cutting operations.
II. Equipment Structural Characteristics
Stone cutting conditions are harsh. The multi-wire cutting machine adopts a high-rigidity structural design, capable of withstanding the strong impacts and high wear during the cutting of high-density stones such as granite. It possesses excellent structural stability and durability, suitable for long-term heavy-duty operations.
III. Industry Application Scenarios
Mining: Widely used in stone quarrying operations to achieve efficient and standardized cutting of natural stone raw materials.
Architectural Decorative Stone Processing: Performs core cutting processes in the large-scale production of architectural veneer stone and decorative panels, serving as a key processing equipment in the industry.
IV. Performance Characteristics of Diamond Cutting Wire for Stone Processing
(I) Wire Diameter Specifications
The diameter of diamond cutting wire for stone processing is significantly larger than that of diamond wire for semiconductor cutting. The standard diameter range is 0.5–1.0 mm and above. The increased diameter improves the overall strength and wear resistance of the wire, meeting the requirements for cutting large-format blocks.
(II) Diamond Abrasive Configuration
The cutting wire is equipped with industrial-grade diamond abrasive, whose particle size and hardness are higher than those of diamond wire for semiconductor cutting. This enables efficient cutting of high-hardness stone, ensuring cutting efficiency and processing stability.
(III) Structural Forms
Beaded Structure: Diamond-impregnated abrasive beads are spaced apart on the wire surface, separated by springs or elastic spacers, forming segmented cutting units.
Sintered Structure: Some products use a direct sintering process for diamond particles, creating a continuous cutting surface and improving cutting uniformity and service life.
